5" Diamond Wafering Blade (Medium Grit / Low Conc.), WB-0055LC sic-1000p12-100

Name: 5" Diamond Wafering Blade (Medium Grit / Low Conc.), WB-0055LC sic-1000p12-100
Brand: thisistricks.com
SKU: 70717130027
Price: 336.00 USD
Availability: InStock
Rating: 4.3708 (7 reviews)

thisistricks.com

$ 336.00

Tax included. Shipping calculated at checkout.

Description

5" Diamond Wafering Blade (Medium Grit / Low Conc.), WB-0055LC sic-1000p12-1005 inch Diamond Wafering Blade (medium grit, low conc.)

Sold in packages of 10 blades

10-inch 1200 grit SiC Abrasive Grinding Paper (Plain Backed) (100/box)

available in 5 lbs

075-inch x 32 mm (~1

14-inch 1000 grit SiC Abrasive Grinding Paper (Plain Backed) (100/box)

10-inch Combination PSA (adhesive backed)-backed SiC papers (240

14-inch 180 grit SiC Abrasive Grinding Paper (Plain Backed) (100/box)

8-inch 120 grit Premium SiC Abrasive Grinding Paper (Plain Backed) (50/box)

8-inch 320 grit SiC PSA (adhesive backed) Abrasive Grinding papers

4-inch stainless steel general purpose diamond/CBN Wafering Blade

4-inch stainless steel low concentration diamond Wafering Blade medium grit

12-inch 60 grit SiC PSA (adhesive backed) Abrasive Grinding papers

Easy Shipping

Quick Dispatch:

Your 5" Diamond Wafering Blade (Medium Grit / Low Conc.), WB-0055LC sic-1000p12-100 orders ship within 1-2 business days.

Delivery Options:

Standard: 3-7 business days
Fast: 2-3 business days
Express: 1-2 business days

Order Tracking:

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